Tel: 01243 513897 Email: mct@aspire-electronics.co.uk
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Aspire Electronics Ltd.
Unit 1
Allens Yard
Aldingbourne
West Sussex
PO20 3UA
Tel: +44 (0) 1243 513897

Taping and Reeling Services

Aspire Electronics are pleased to bring Tape and Reeling Services to our existing and new customers.
Tape and Reel Services include:
  • All packages supported: QFP, TSOP, TSSOP, SO, SSOP, PLCC, MLF, QFN, BGA connector, odd-form etc
  • High volume capacity using ‘state of the art’ automatic T and R equipment with full 3D vision capabilities
  • Fast product turnaround
  • Bake, Drypack, Pizza Box and Bar Code Label options
  • Wafer Level package tape and reel or waffle pack with full 3D inspection
Service also include:
  • SMD Tape and Reel
  • Wafer Level Package T and R or Waffle Pack
  • Specials / Axial and Radial
  • Lead Forming and Refurbishment
  • Lead Conditioning
  • Component Preparation and Odd Form Devices
  • Laser Marking and Bake and Dry Pack
Devices may be received in a variety of formats: wafer, strip, film frame, tray, tube or loose.
Semiconductors, electro-mechanical and mechanical devices are accommodated in technologies ranging from legacy Pin through hole (PTH) Axial and Radial technology through surface mount device (SMD) to Wafer Level (WLP).